Modern semiconductor fabrication operates at the nanometer scale, where surface quality, film uniformity, contamination, and interfacial properties directly determine device performance and production yield. As feature sizes continue to shrink, precise, non-destructive surface characterization becomes critical at every process step. NewRoad provides instruments for wafer surface analysis, wettability measurement, and thin-film characterization for semiconductor R&D and process monitoring.
Raman Spectroscopy is a non-destructive analytical technique used to identify molecular composition, chemical structure, and material properties.
A scanning probe technique that images and measures surface properties at the nanometer scale by detecting tip-surface forces — operating in air, liquid or vacuum without special sample preparation.
X-ray fluorescence and glow discharge spectroscopy provide fast, accurate multi-element composition analysis of solid materials and thin films, from bulk characterization to nanometer-scale depth profiling.
Measurement of light absorption, transmission and reflectance across the ultraviolet, visible and near-infrared spectrum — for chemical identification, concentration measurement and process monitoring.
Passive and active vibration isolation platforms protect precision instruments from environmental disturbances, ensuring sub-nanometer measurement stability in AFM, interferometry, and other high-resolution techniques.
