The HORIBA Auto SE is an automated spectroscopic ellipsometer optimized for production environments and high-throughput thin film characterization, combining fast measurement speed with high accuracy for wafer-scale quality control and process monitoring.
The HORIBA Auto SE is a spectroscopic ellipsometer designed for automated, high-throughput thin film measurement in production environments, R&D lines, and quality control laboratories where measurement speed, repeatability, and automation capability are critical. Building on HORIBA’s ellipsometry expertise, the Auto SE combines a fast rotating-analyzer ellipsometer with a spectrographic detector to acquire full spectral ellipsometry data simultaneously across the visible range without mechanical scanning, allowing measurement times well under one second per point. This speed enables high-throughput wafer mapping (measuring tens to hundreds of points per wafer for uniformity and thickness maps), inline process monitoring, and rapid feedback for process control. The Auto SE is designed for simple, repeatable sample loading and positioning, with software that enables recipe-driven automated measurements, batch processing, and integration with factory automation systems. The optical design provides accurate, reproducible measurement of SiO2, Si3N4, polysilicon, metal films, photoresists, and other process-relevant thin films commonly encountered in semiconductor and MEMS fabrication. Results — thickness, refractive index, and optical constants — are extracted automatically using pre-loaded material libraries and measurement recipes. The instrument connects to DeltaPsi2 or WINSEMIAN software for data management and statistical process control (SPC) analysis. NewRoad provides the HORIBA Auto SE in Israel for semiconductor fabs, MEMS manufacturers, photovoltaics production, and R&D thin film laboratories requiring fast, automated thin film characterization at production scale.
Spectroscopic ellipsometry (rotating analyzer + spectrographic detector)
Visible (optimized for process film characterization)
Sub-second per point for high-throughput wafer mapping
Recipe-driven, batch processing, factory automation integration
Semiconductor process control, MEMS, PV, thin film QC
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